• Description

Simulating Electronics Components

The development of MEMS devices, integrated circuits (ICs or chips), and printed circuit boards (PCBs) requires greater and greater accuracy in predicting device characteristics and performance, even before manufacturing a prototype. Ever diminishing component sizes demand simulations that incorporate the interactions of several physical phenomena. Using the ECAD Import Module, you can import your ECAD files into COMSOL Multiphysics and convert the 2D layouts into 3D geometry that is suitable for simulation. This opens up a world of simulations, including, among other applications, the electromagnetic, thermal, and structural behavior of these components and devices.

Importing ECAD Formats into COMSOL Multiphysics

The formats for transferring ECAD data contain the layouts of each layer that makes up a device, whether this is a chip or PCB. The ECAD Import Module will recognize the geometrical shapes on these layouts and construct plane geometry objects that can be extruded according to the layer stack-up information found in the file or provided during import. For MEMS and IC simulation needs, the ECAD Import Module supports the GDSII format. For developing PCBs, the ODB++™, ODB++(X) and NETEX-G file formats can be imported. The NETEX-G format is the native format of a program with the same name, which can be used to extract the connected metal traces for a particular net from Gerber layout and drill files, which are used widely when sending PCB designs for fabrication.

Treating Imported ECAD Files

Depending on the file format, the import functionality provides options for configuring the cells or nets that should be used for geometry construction. You can also exclude layers, edit layer thicknesses and elevations, decide how bond wires should be represented in the final geometry, and even fine-tune the parameters for arc recognition. For a faster set-up of the import process, it is possible to load the layer configuration information from a text file. To further shorten the time spent on setting up simulations, you can configure the import to automatically create selections for each layer. These selections are then available when you are assigning physics settings to domains and boundaries.

The 3D geometry objects constructed from the ECAD layouts can be further modified using available features in COMSOL Multiphysics. When combined with the CAD Import Module or one of the LiveLink™ products, the 3D geometry can be exported to the ACIS® or Parasolid® file formats for use in other software.

Parasolid is a registered trademarks of Siemens Product Lifecycle Management Software Inc. or its subsidiaries in the United States and in other countries. ACIS is a registered trademark of Spatial Corporation.

Support for implementation of the ODB++™ Format was provided by Mentor Graphics Corporation pursuant to the ODB++ Solutions Development Partnership General Terms and Conditions (http://www.odb-sa.com/). ODB++ is a trademark of Mentor Graphics Corporation.